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February 09 2010

Technology Insights
Time Domain Modeling and Simulation of Intel QuickPath Interconnect Circuits (Part 1 of 3)

This article explores and explains key issues related to modeling and simulation in this interconnect scheme, but its lessons apply to other designs as well

Additional Insights
more features 

Miniaturized comparators offer portable applications benefits

STMicroelectronics has completed its portfolio of industry-standard comparators in space-saving packages with the introduction of the LMV331 packaged in a choice of 2.00 x 1.25 mm SC70 or 2.90 x 1.60 mm SOT23 form factors.

more products 

Top Story
ISSCC: Expert picks winner for post-CMOS era
Chip scaling is expected to continue for at least the next 15 years, according to one expert, who also predicted perhaps the next technology after the post-CMOS era.
Also in the News
more headlines 

Looking ahead: Data converter trends for 2010

Guest Column: Converters are key to mixed-signal products; here's a perspective on where they are headed in terms of performance, power, and functionality. . . .
more 

more columns 

more product announcements 





VC investment fell in 2009
Venture capitalists invested $17.7 billion in 2,795 deals in 2009, marking the lowest level of dollar investment since 1997, according to the MoneyTree Report by PricewaterhouseCoopers and the National Venture Capital Association (NVCA). Venture investments in 2009 represented a 37 percent decrease in dollars and a 30 percent decrease in deal volume from 2008. It was the second consecutive year of annual deal and dollar declines.



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