Steve Taranovich, Senior Technical Editor, EDN, 5/23/2013 Comment now 12 comments
Designers, who need to build high performance real-time sensing systems, are greatly challenged since every building block in the system needs to be built with a technology that allows that building block to achieve its best performance. 3D stacking is emerging as an option to allow the integration of those heterogeneous blocks.
Most recent post, Scott Elder, 5/23/2013 6:35:42 PM
The real value in flip chip is in how the ICs are made. Rather than taking...
The real value in flip chip is in how the ICs are made. Rather than taking...
Bill Schweber, Engineer, Author, Editor, 5/23/2013 Comment now 4 comments
Whenever I see a new product announcement saying an analog or mixed-signal component is "programmable," my first thought is simple: "in what way?" Often, it's not called out clearly or until the end of the press release.
Most recent post, Brad Albing, 5/23/2013 4:50:31 PM
OK, now that sounds pretty useful. I could have used that in several previous designs...
OK, now that sounds pretty useful. I could have used that in several previous designs...
Vincent Biancomano, Contributing Editor, 5/22/2013 Comment now 2 comments
The last time I visited the "build or buy" issue, a lot of small commercial engineering outfits were looking to the big companies for in-house support for their various products for the burgeoning wireless market.
Most recent post, analoging , 5/23/2013 3:58:36 PM
Speaking of design, I find it interesting how ARM has taken over the apps processor...
Speaking of design, I find it interesting how ARM has taken over the apps processor...
Dennis Feucht, Electronics Engineer, 5/22/2013 Comment now 9 comments
The story of analog integration in test instruments is long, storied, and rife with names renowned in the annals of analog design who innovated upon each others' design to realize the foundation of today's circuits.
So what is the state of integration of the analog circuitry in test instruments? Measurement on a chip started long ago and continues ...
Most recent post, analoging , 5/23/2013 4:06:49 PM
Ahhh, those were the days...running manual multi-meter measurements and recording...
Ahhh, those were the days...running manual multi-meter measurements and recording...
Brian Coppa, Director, Coppa Consulting, 5/21/2013 Comment now 2 comments
Uncertainty hangs over the market for power devices made with the wide-bandgap semiconductor SiC (silicon carbide), due to uncertainty as to when EVs (electric vehicles) will adopt them for various applications under the hood, according to a recent study by analyst firm Yole Développement.
Most recent post, analoging , 5/23/2013 3:39:15 PM
Thanks for the comments. SiC has a lot riding on the future of electric cars- no...
Thanks for the comments. SiC has a lot riding on the future of electric cars- no...
Scott Elder, Senior Analog IC Design Consultant, 5/21/2013 Comment now 4 comments
"Gallium Arsenide (GaAs) is the silicon of the future. Is and always will be." That was the humorous perspective circulating among analog technologists in the late 1980s. In a similar vein, I can't count the number of times I've had people ask me when will the world see a field programmable analog array (FPAA) -- the analog counterpart to the digital ...
Most recent post, Brad Albing, 5/23/2013 10:31:01 AM
Hmm... 3-D printing an IC at your desk - that's actually not a bad idea. Probably...
Hmm... 3-D printing an IC at your desk - that's actually not a bad idea. Probably...
most commented
13
Thermocouple Nodules, Cold Junctions & Integration Opportunities
Dennis Feucht, Electronics Engineer, 5/17/2013
Dennis Feucht, Electronics Engineer, 5/17/2013
12
Operations per Joule
Brian Bailey, Independent Consultant, 5/20/2013
Brian Bailey, Independent Consultant, 5/20/2013
12
3D Stacking Offers New Path to Optimum Integrated Analog Performance
Steve Taranovich, Senior Technical Editor, EDN, 5/23/2013
Steve Taranovich, Senior Technical Editor, EDN, 5/23/2013
9
An Instrument on a Chip? A Look Back
Dennis Feucht, Electronics Engineer, 5/22/2013
Dennis Feucht, Electronics Engineer, 5/22/2013
7
Using ICs in the Land Beyond Their App-Notes
Derek Koonce, Owner, DDK Interactive Consulting Services, 5/20/2013
Derek Koonce, Owner, DDK Interactive Consulting Services, 5/20/2013








