Steve Taranovich, Senior Technical Editor, EDN, 5/23/2013 Comment now 2 comments
Designers, who need to build high performance real-time sensing systems, are greatly challenged since every building block in the system needs to be built with a technology that allows that building block to achieve its best performance. 3D stacking is emerging as an option to allow the integration of those heterogeneous blocks.
Most recent post, SteveTaranovich, 5/23/2013 12:23:51 PM
A flip chip is a chip packaging technique in which the active area of the chip is...
A flip chip is a chip packaging technique in which the active area of the chip is...
Bill Schweber, Engineer, Author, Editor, 5/23/2013 Comment now 1 Comment
Whenever I see a new product announcement saying an analog or mixed-signal component is "programmable," my first thought is simple: "in what way?" Often, it's not called out clearly or until the end of the press release.
Most recent post, Brad Albing, 5/23/2013 10:20:40 AM
>>you have an array of analog functions and can configure their interconnect...
>>you have an array of analog functions and can configure their interconnect...
Vincent Biancomano, Contributing Editor, 5/22/2013 Comment now 1 Comment
The last time I visited the "build or buy" issue, a lot of small commercial engineering outfits were looking to the big companies for in-house support for their various products for the burgeoning wireless market.
Most recent post, Vishal Prajapati, 5/23/2013 7:09:09 AM
This has been the debate for almost every one from SME to PSUs. Probably PSUs don't...
This has been the debate for almost every one from SME to PSUs. Probably PSUs don't...
Dennis Feucht, Electronics Engineer, 5/22/2013 Comment now 8 comments
The story of analog integration in test instruments is long, storied, and rife with names renowned in the annals of analog design who innovated upon each others' design to realize the foundation of today's circuits.
So what is the state of integration of the analog circuitry in test instruments? Measurement on a chip started long ago and continues ...
Most recent post, Brad Albing, 5/23/2013 10:13:25 AM
I recall that blog. That was a nifty piece of test equipment, and a good example...
I recall that blog. That was a nifty piece of test equipment, and a good example...
Brian Coppa, Director, Coppa Consulting, 5/21/2013 Comment now 1 Comment
Uncertainty hangs over the market for power devices made with the wide-bandgap semiconductor SiC (silicon carbide), due to uncertainty as to when EVs (electric vehicles) will adopt them for various applications under the hood, according to a recent study by analyst firm Yole Développement.
Most recent post, Dirceu Rodrigues Jr, 5/22/2013 11:14:56 AM
The first time I heard about an application for Silicon Carbide...
The first time I heard about an application for Silicon Carbide...
Scott Elder, Senior Analog IC Design Consultant, 5/21/2013 Comment now 4 comments
"Gallium Arsenide (GaAs) is the silicon of the future. Is and always will be." That was the humorous perspective circulating among analog technologists in the late 1980s. In a similar vein, I can't count the number of times I've had people ask me when will the world see a field programmable analog array (FPAA) -- the analog counterpart to the digital ...
Most recent post, Brad Albing, 5/23/2013 10:31:01 AM
Hmm... 3-D printing an IC at your desk - that's actually not a bad idea. Probably...
Hmm... 3-D printing an IC at your desk - that's actually not a bad idea. Probably...
most commented
13
(Dis)Integrating Power Consumption, Counterintuitively
Len Sherman, Senior Scientist, Maxim Integrated, 5/16/2013
Len Sherman, Senior Scientist, Maxim Integrated, 5/16/2013
13
Thermocouple Nodules, Cold Junctions & Integration Opportunities
Dennis Feucht, Electronics Engineer, 5/17/2013
Dennis Feucht, Electronics Engineer, 5/17/2013
11
Operations per Joule
Brian Bailey, Independent Consultant, 5/20/2013
Brian Bailey, Independent Consultant, 5/20/2013
8
An Instrument on a Chip? A Look Back
Dennis Feucht, Electronics Engineer, 5/22/2013
Dennis Feucht, Electronics Engineer, 5/22/2013
7
Using ICs in the Land Beyond Their App-Notes
Derek Koonce, Owner, DDK Interactive Consulting Services, 5/20/2013
Derek Koonce, Owner, DDK Interactive Consulting Services, 5/20/2013








