LONDON – Europe's leading chip companies must join forces to compete in the investment-intensive semiconductor business, according to Heinz Kundert, president of the Europe branch of industry association SEMI.
"Europe must not risk walking away from the most important global key industry, or we will fall behind in other international industries, too," he said in a statement issued to coincide with the opening of the three-day Semicon Europa exhibition being held in Dresden, Germany, Oct. 9 to 11.
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Kundert said Europe is at a crossroads. The European Commission has recently re-emphasized the importance of micro- and nanoelectronics as key enabling technologies of strategic interest to wealth creation in Europe. However, over the last decade Europe's chip companies have increasingly pulling back from the extreme cost of leading-edge of digital chip manufacture and started implementing so-called fab-lite strategies.
In his text Kundert acknowledged that European companies cannot cope with the necessary investments on their own any more. "Therefore it is important for the industry to see itself as a European industry that is advocating its coordinated and consolidated interests both with the European Commission and with national governments. We all need to speak with one voice," Kundert said. "At the same time we have to clarify to what extent the key-enabling-technology-initiative is represented in EU promotional programs."
Semicon Europa is being held alongside the Plastic Electronics Exhibition and Conference, the International MEMS/MST Forum and the Advanced Packaging Conference.
When your home’s deep freezer, full of food, experiences an AC power failure while you are out for an extended time, its contents can thaw out. If the AC power is then restored before you return home, the contents can re-freeze and you may never know that your food is spoiled. This has given rise over the years to a number of freezer-alarm circuits and methods to detect thaw and re-freeze.
It seems like we just had LTE and LTE Advanced beginning deployment in base stations everywhere. In spite of that effort, there has been heavy discussion of early development ideas of the 5G next-gen architecture to meet the ever-growing demands of the cellular airwave capacity, speed and customer future needs.
If you have worked in the semiconductor industry for more than a few years I am sure you have heard senior leadership speak about the need for your integrated circuit designs to be first pass successes and not the typical two to three spins or more to reach the targeted performance. The question is this: Is first pass success feasible and should be expected? I do not want to stir up a hornets nest with my response but the answer to the question is that it depends. Depends on what you say? Well, the answer depends on several different interwoven complexities that can determine if first pass success is possible. I would like to explore some possible ways to answer this question. Furthermore, the complexity of this question increases when developing complex mixed signal IC’s.
Fortunately for circuit designers, a new tool is available that can simplify the process of identifying the ESD suppression device best suited to an application, which makes it far easier to incorporate circuit protection earlier in the board planning process. The Littelfuse iDesign™ Online Simulation and Product Selection Tool
. I received a very good reader question from my last blog post regarding the various parameters that are reported by the tool. Let’s take a look at an example and explore the parameters that are returned. In this example we will look at the AD9643-250.