LONDON – Nanium SA (Porto, Portugal), formerly known as Qimonda Portugal and one of few chip packaging and test companies left in Europe, has announced it has shipped its 200 millionth embedded wafer-level BGA (eWLB) component for wireless communications and other applications.
The main reason to use eWLB technology is that it allows greater fan-out and pin-counts than conventional wafer-level packaging and more space for interconnect routing and thinner packages.
The 300-mm eWLB uses a combination of front-end and back-end semiconductor manufacturing techniques, and Nanium said it has adapted the process for consumer MEMS, stacked-die DRAM multichip packages (MCP) and mixed-signal RF ASIC applications.
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"This milestone, which we have reached in less than two years, demonstrates that eWLB technology is a robust low-cost solution delivering both high reliability and high yields for manufacturing advanced electronic products with high I/O density in a small form-factor," said Armando Tavares, Nanium president, in a statement.
Managing system thermal performance is critical in today’s electronic systems if you are to maximize performance and the user experience. As systems grow more powerful, and in many cases smaller in size, managing the thermal profile has become an ever-increasing challenge. Monitoring the current provides a leading indicator to potential thermal issues.
In blog number 3, we are going to divert a little from our normal trend of evaluating power supply design and simulation tools. Instead, we are going to look into power management tools that are online.
In today’s connected world, software frequent-field updates are necessary to improve accuracy, or add on benefits or even fix bugs. If you like these updates to be invisible to you, you are going to love this idea - Instant updates that do not require your software to restart or cause any glitch in the power supply.