LONDON – Nanium SA (Porto, Portugal), formerly known as Qimonda Portugal and one of few chip packaging and test companies left in Europe, has announced it has shipped its 200 millionth embedded wafer-level BGA (eWLB) component for wireless communications and other applications.
The main reason to use eWLB technology is that it allows greater fan-out and pin-counts than conventional wafer-level packaging and more space for interconnect routing and thinner packages.
The 300-mm eWLB uses a combination of front-end and back-end semiconductor manufacturing techniques, and Nanium said it has adapted the process for consumer MEMS, stacked-die DRAM multichip packages (MCP) and mixed-signal RF ASIC applications.
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"This milestone, which we have reached in less than two years, demonstrates that eWLB technology is a robust low-cost solution delivering both high reliability and high yields for manufacturing advanced electronic products with high I/O density in a small form-factor," said Armando Tavares, Nanium president, in a statement.
Without even thinking about it, consumers depend on technology throughout the day as they send texts, turn on lights, and drive home from the office. But that technology depends on something that usually goes unnoticed until there's a problem.
I thought it would be good to continue looking at the example I gave in my last blog where we looked using fewer LDOs and combining power supply rails on an ADC while maintaining isolation with ferrite beads.
Electronic equipment and power management is becoming increasingly critical as our power grid ages and renewable energy comes on line. In response, new technologies are being developed to protect equipment from power disturbances and fluctuations.