LONDON – The market for mobile handset ICs, including platform and connectivity ICs, was about $32.2 billion in 2011 and is forecast to grow 11 percent in 2012 to reach $35.7 billion, according to market research firm ABI Research.
Qualcomm was the leading supplier of mobile ICs in 2011 with 26 percent, ABI said. The company expects Qualcomm to lead again in 2012 but did not give a market share estimate for 2012.
Rival analyst Strategy Analytics recently estimated Qualcomm's market share at 48 percent in the first half of 2012.
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MediaTek is following hot on Qualcomm’s heels with its MT6575 platform for low- to mid-end smartphones and is changing from a lower-end handset to a smartphone-focused supplier. Broadcom continues to lead the handset wireless connectivity market with almost 40 percent revenue market share, due largely to its strength in the combo IC market.
Qualcomm, Broadcom, Texas Instruments, and MediaTek are strong in both platform ICs and connectivity ICs
"For all handset IC suppliers their future fortunes in the market will be bound by their ability to embrace integration and supply the market with compelling solutions that enable high functionality whilst keeping costs down," said Peter Cooney, director of semiconductors, at ABI Research, in a statement.
Fortunately for circuit designers, a new tool is available that can simplify the process of identifying the ESD suppression device best suited to an application, which makes it far easier to incorporate circuit protection earlier in the board planning process. The Littelfuse iDesign™ Online Simulation and Product Selection Tool
. I received a very good reader question from my last blog post regarding the various parameters that are reported by the tool. Let’s take a look at an example and explore the parameters that are returned. In this example we will look at the AD9643-250.
Managing system thermal performance is critical in today’s electronic systems if you are to maximize performance and the user experience. As systems grow more powerful, and in many cases smaller in size, managing the thermal profile has become an ever-increasing challenge. Monitoring the current provides a leading indicator to potential thermal issues.
In blog number 3, we are going to divert a little from our normal trend of evaluating power supply design and simulation tools. Instead, we are going to look into power management tools that are online.