SAN FRANCISCO—Chip vendor STMicroelectronics NV Thursday (Nov. 15) issued a statement strongly denying the company is splitting up after an international news service reported that there was a proposal on the table to split the company up.
ST (Geneva) said it strongly denied the existence of a project would could "compromise the unity of the company" in a statement.
"Also, such a project has never been presented to the ST supervisory board," the statement read. "There is full alignment between the management of the company and the supervisory board of directors."
The Bloomberg news service reported Thursday that ST wouldprobably decide against splitting itself up after disagreements between French and Italian executives over a breakup proposal. According to Bloomberg, the break up proposal under consideration would have split ST between its analog and digital businesses.
Bloomberg, citing unnamed sources, said the proposal would likely be shelved in favor of small asset sales.
When your home’s deep freezer, full of food, experiences an AC power failure while you are out for an extended time, its contents can thaw out. If the AC power is then restored before you return home, the contents can re-freeze and you may never know that your food is spoiled. This has given rise over the years to a number of freezer-alarm circuits and methods to detect thaw and re-freeze.
It seems like we just had LTE and LTE Advanced beginning deployment in base stations everywhere. In spite of that effort, there has been heavy discussion of early development ideas of the 5G next-gen architecture to meet the ever-growing demands of the cellular airwave capacity, speed and customer future needs.
If you have worked in the semiconductor industry for more than a few years I am sure you have heard senior leadership speak about the need for your integrated circuit designs to be first pass successes and not the typical two to three spins or more to reach the targeted performance. The question is this: Is first pass success feasible and should be expected? I do not want to stir up a hornets nest with my response but the answer to the question is that it depends. Depends on what you say? Well, the answer depends on several different interwoven complexities that can determine if first pass success is possible. I would like to explore some possible ways to answer this question. Furthermore, the complexity of this question increases when developing complex mixed signal IC’s.
Fortunately for circuit designers, a new tool is available that can simplify the process of identifying the ESD suppression device best suited to an application, which makes it far easier to incorporate circuit protection earlier in the board planning process. The Littelfuse iDesign™ Online Simulation and Product Selection Tool
. I received a very good reader question from my last blog post regarding the various parameters that are reported by the tool. Let’s take a look at an example and explore the parameters that are returned. In this example we will look at the AD9643-250.