LONDON – Toshiba has announced that this month it will start production of white light emitting diodes intended for use by makers of general purpose and industrial lighting using Bridgelux technology.
The white LEDs are made using gallium nitride grown on 200-mm diameter wafers of silicon. Toshiba said it plans to ramp capacity up to 10 million LEDs per month and said it wants to secure a 10 percent market share by 2016.
Production of LED chips is typically done on 2- to 4-inch sapphire wafers. Bridgelux Inc. (Livermore, Calif.) developed a method of manufacturing gallium nitride LEDs on 200-mm silicon wafers, which provides a cost advantage. With backing for Bridgelux from Toshiba, that process was brought to Kaga Toshiba Electronics Corporation, a discrete products manufacturing facility in northern Japan. Plessey Semiconductors Ltd. (Plymouth, England) has also adopted a GaN-on-Si process for LED production but is presently ramping with 6-inch diameter wafers.
The first product of the Toshiba GaN-on-Si line is the TL1F1 series of LEDs that produce 112 lumens at 350-milliamps current. The packaged parts measure 6.4-mm by 5.0-m by 1.35-mm.
Without even thinking about it, consumers depend on technology throughout the day as they send texts, turn on lights, and drive home from the office. But that technology depends on something that usually goes unnoticed until there's a problem.
I thought it would be good to continue looking at the example I gave in my last blog where we looked using fewer LDOs and combining power supply rails on an ADC while maintaining isolation with ferrite beads.
Electronic equipment and power management is becoming increasingly critical as our power grid ages and renewable energy comes on line. In response, new technologies are being developed to protect equipment from power disturbances and fluctuations.