LONDON – Toshiba has announced that this month it will start production of white light emitting diodes intended for use by makers of general purpose and industrial lighting using Bridgelux technology.
The white LEDs are made using gallium nitride grown on 200-mm diameter wafers of silicon. Toshiba said it plans to ramp capacity up to 10 million LEDs per month and said it wants to secure a 10 percent market share by 2016.
Production of LED chips is typically done on 2- to 4-inch sapphire wafers. Bridgelux Inc. (Livermore, Calif.) developed a method of manufacturing gallium nitride LEDs on 200-mm silicon wafers, which provides a cost advantage. With backing for Bridgelux from Toshiba, that process was brought to Kaga Toshiba Electronics Corporation, a discrete products manufacturing facility in northern Japan. Plessey Semiconductors Ltd. (Plymouth, England) has also adopted a GaN-on-Si process for LED production but is presently ramping with 6-inch diameter wafers.
The first product of the Toshiba GaN-on-Si line is the TL1F1 series of LEDs that produce 112 lumens at 350-milliamps current. The packaged parts measure 6.4-mm by 5.0-m by 1.35-mm.
Managing system thermal performance is critical in today’s electronic systems if you are to maximize performance and the user experience. As systems grow more powerful, and in many cases smaller in size, managing the thermal profile has become an ever-increasing challenge. Monitoring the current provides a leading indicator to potential thermal issues.
In blog number 3, we are going to divert a little from our normal trend of evaluating power supply design and simulation tools. Instead, we are going to look into power management tools that are online.
In today’s connected world, software frequent-field updates are necessary to improve accuracy, or add on benefits or even fix bugs. If you like these updates to be invisible to you, you are going to love this idea - Instant updates that do not require your software to restart or cause any glitch in the power supply.