45nm wireless device offers 63 percent power reduction

San Francisco—At the International Solid-State Circuits Conference (ISSCC) last week, Texas Instruments Inc. disclosed process and design advancements enabling the first 45nm 3.5G baseband and multimedia processor addressing critical power challenges in the wireless market.

TI's 45nm process incorporates various technology advancements and design techniques along with new SmartReflex 2 power and performance management technologies. With these advancements, wireless customers will be able to deliver smaller, sleeker devices with advanced multimedia functionality, realizing a 55 percent performance increase and 63 percent power reduction versus the 65nm process, according to TI.

TI's low-power 45nm process is designed to address the specific needs of the portable device market, initially mobile handsets, which uses immersion lithography tools and ultra-low K dielectrics to double the number of chips produced on each silicon wafer, while giving its customers a performance boost over the current 65nm low power process. The performance enhancement is achieved through a number of proprietary techniques including strained silicon to further reduce leakage in the 45nm process.

TI's first 45nm wireless digital and analog design platform leverages and integrates hundreds of millions of transistors in a 12mm x 12mm package. The platform includes a high-throughput communication and high-performance multimedia applications engine based on an ARM11, high performance TMS320C55x digital signal processor (DSP), and an image signal processor, bringing a consumer-electronics quality experience to mobile handsets that work across multiple wireless standards. A number of analog components are also integrated, including an RF codec.

Texas Instruments,

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