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AC-DC power conversion chips housed in low-profile package

San Jose, Calif.—Power Integrations announced an ultra-low-profile package called eSIP-L for its TOPSwitch-HX family of AC-DC power conversion ICs.

This small new package combined with the high efficiency and operating frequency of TOPSwitch-HX enables slim, compact, and lightweight power supplies from 20 to 100 watts. Applications include adapters for notebook computers, as well as power supplies for LCD monitors and flat-panel TVs.

The new “L” shaped lead-bend allows the company's eSIP package to lie flat against the PCB with the heatsink pad facing upwards. The device stands 2 millimeters above the board, giving plenty of space for a heatsink and enabling slender power supply designs.

The company also developed a reference design (DER-196) for a 65 W notebook adapter only slightly larger than a standard deck of playing cards. The design, which complies with the upcoming ENERGY STAR 2.0 specifications for external power supplies, uses a TOP261 chip in the new eSIP-L package. The IC combines a 700 V switching power MOSFET with controller and supervisory functions into a single monolithic IC, reducing the need for bulky heatsinks required in designs using traditional TO-220 packaged MOSFETs and discrete controllers, and eliminating the need to encase the electronics with thermally conductive potting compound.

The package's 90-degree pin deflection enables the PCB, chip and heatsink to lie parallel to each other, while the high switching frequency of TOPSwitch-HX eliminates the need for an expensive planar type transformer. This, together with Power Integrations' proprietary transformer design, reduces both the cost and size of the notebook adapter.

Pricing: $1.00/ea in 10K unit quantities.
Availability: TOP260LN, TOP261LN and TOP262LN devices suitable for slim adapters from 20 W to 100 W power levels are available in the eSIP-L package style immediately.

Power Integrations, www.powerint.com

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