Each week, the editor of Planet Analog finds items of interest and then features them in two sections, entitled “Also of Interest” and “Elementals”. Each cites items from publications outside the Planet Analog and EETimes portfolios.
It's an extension of our belief that engineers are interested in on-going tutorial on obviously relevant topics, as well as the serendipity of exploring topics which are not directly related to their jobs, but which will broaden their knowledge and sometimes spurs innovative and creative approaches. The first box highlights a few items of general interest to the engineer, while the second highlights some basic and tutorial electronic-engineering material.
Among the publications we check are IEEE Spectrum , Machine Design , Design News , Laser Focus World , EDN , Electronic Design , NASA Tech Briefs , Portable Design , and Physics Today , plus others.
Consider these items as “online-only” extras, and worth a look! (Please note: there are also links to the previous weeks' editions, at the bottom).
Also of Interest:
- It is long past the time when inventors only needed to worry about protecting their ideas in the U.S. Global patent protection is a must:
“Intellectual Property: Should you patent globally?,”
Machine Design , May 8, 2008 - A novel direct-drive linear servomotor with only one moving part needs special design considerations:
“How to Apply Direct-Drive Linear Servomotors,”
Machine Design , May 8, 2008 - This history of Microwave Journal as told through the articles that appeared in the magazine over the past 50 years is also the history of the microwave industry as told by those in the business:
“A Microwave Journey: 1958″2008, Part I,”
Microwave Journal , July 2008 - The flow of sand is redirected for better filling and compaction:
“Improved Sand-Compaction Method for Lost-Foam Metal Casting,”
NASA Tech Briefs , July 2008
Elementals:
- How many EEs does it take to screw in a light bulb? Maybe we should ask why EEs should care:
“Beyond The $10 Million Light Bulb,”
Electronic Design , July 24, 2008 - Wafer-level, SiP, and PoP methodologies combined with TSV interconnections help overcome IC miniaturization challenges:
“Shrinking ICs Need High Density In A Package Deal,”
Electronic Design , July 24, 2008 - You can make a 1-kV dc/dc converter with only 100 microvolts of noise:
“High-voltage, low-noise dc/dc converters,”
EDN , August 7, 2008 - A number of different RF front-end topologies are appropriate for software radios, each with its own advantages and disadvantages:
“RF Receiver Front-End Topologies for Software Radios,”
Portable Design , July 2008
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Previous Editions:
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