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Atmel : System-in-package suits LIN networking



Atmel Corporation has announced the availability of a System-in-Package (SiP) solution for LIN automotive networking applications. The ATA6617, featuring maximum integration, is the first member of an upcoming LIN SiP family. It combines Atmel’s LIN System Basis Chip (SBC) ATA6624 – including LIN transceiver, voltage regulator, watchdog – and a well-known AVR® microcontroller (ATtiny167 with 16k flash memory) in a single package. With this highly integrated solution, customers can create complete LIN nodes using just one IC.

The new LIN SiP is based on Atmel’s second-generation LIN IP with excellent EMC and ESD performance. It is optimized for low-cost LIN slave applications and enables system cost reductions of up to 25%. A powerful LIN UART with integrated hardware routines simplifies protocol stack handling and limits the interrupt generation, thus reducing the microcontroller load and flash memory consumption. Simple assignment of an individual physical LIN node address, which is important in applications such as air-conditioning systems, can be realized by using an integrated 100 microampere current source.

One important criteria for LIN applications is low current consumption. To ensure that the LIN node’s current consumption is well below 100 microampere in applications that are continuously connected to the battery, the ATA6617 provides several current saving modes where different functionalities are individually switched off or on, depending on the application requirements.

All pins of the LIN system basis chip and the microcontroller are bonded out, thus providing customers the same flexibility and performance for their applications as with discrete parts.

Thanks to the extremely small QFN38 package, measuring only 5 mm x 7 mm, designers can save more than 50% of PCB size compared to conventional solutions.

Availability and Pricing

Samples of the new LIN IC ATA6617 are now available in small QFN38 packages. Pricing starts at US $1.89 for 10k-piece quantities. Various cost-effective tools support designers with the development of LIN networks. A development board is available that enables a quick start with the IC and allows prototyping and testing of new designs. Certified LIN 2.0 and 2.1 protocol stacks from leading suppliers are also available. Further LIN SiP family members including an 8 kB flash memory version, will be announced in Q2 2009.

Footnote

EMC = Electro-Magnetic-Compatibility
ESD = Electronic Static Discharge
IP = Intellectual Property
LIN = Local Interconnect Network
PCB = Printed Circuit Board
QFN = Quad Flat No leads
SBC = System Basis Chip
SiP = System-in-Package

About Atmel

Atmel is a worldwide leader in the design and manufacture of microcontrollers, advanced logic, mixed-signal, nonvolatile memory and radio frequency (RF) components. Leveraging one of the industry’s broadest intellectual property (IP) technology portfolios, Atmel is able to provide the electronics industry with complete system solutions focused on consumer, industrial, security, communications, computing and automotive markets.

Product information on Atmel’s LIN SiP IC ATA6617 may be retrieved at: http://www.atmel.com/dyn/products/product…

Press Contacts:
Dr. Susanne van Clewe, Marcom Director Automotive
Phone: +49 7131 67-2081,
Email:


Note: The above text is the public part of the press release obtained from the manufacturer (with minor modifications). EETimes Europe cannot be held responsible for the claims and statements made by the manufacturer. The text is intended as a supplement to the new product presentations in EETimes Europe magazine.


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