By integrating the automatic detection and switching function in a single device, the TS3A225E audio headset detection and configuration switch IC from Texas Instruments eliminates detection, leakage and click-pop issues.
The chip works seamlessly to extend the functionality of best-in-class TI audio codecs, such as TLV320AIC3262 and TLV320AIC3212. For designers who prefer only a 2×2 crosspoint switch functionality without headset-type detection, TI also offers the reduced-cost TS3A26746E.
The device enhances the end user's experience by supporting three-prong (without microphone) and four-prong (with microphone) audio headsets from all manufacturers. It detects the configuration of the microphone and ground pins on a four-prong headset and routes them appropriately via a 2×2 crosspoint switch.
The IC also prevents audio signal distortion with 66-percent lower on-resistance (100 mOhms) for the ground switch compared to the competition. It comes in both 16-pin QFN and WCSP packages.
Visit Texas Instruments at http://www.ti.com/switches-pr .
This article originally appeared on EE Times Europe.