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Maxim Integrated - Integration Nation
Dennis Feucht

What Are the Limits to Integration?

Dennis Feucht
WKetel
WKetel
5/15/2013 6:46:24 PM
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Artist
Why analog does not shrink so very well.
The limits on analog integration into digital systems are partly based on the condition that analog signals are more normally connected to the real world, where voltages and power levels are much larger. But the very biggest limitation will undoubtedly be the noise generated by the smallness of the connections. A point is reached where the noise becomes large enough to get in the way of whatever was supposed to be happening with the desired signal. 

The other reason is that analog design engineers don't just toss more gates or code at a challenge, they actually need to do real engineering, instead of just piling on more lines of code. That's not a slam, just a fact. nobody would ever design even a thousand transistor analog system, let alone a million opamp system. That is just not how the analog domain works.

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Brad Albing
Brad Albing
5/14/2013 11:28:31 PM
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Blogger
Re: Function Block -IC
OK - I'm not very familiar with SiGe characteristics, so thanks for the info.

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DaeJ
DaeJ
5/14/2013 8:21:49 PM
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Master
Re: Function Block -IC
BiCMOS with SiGe is used commonly for wireless board requiring the fast response among base, emitter and collector. BiCMOS with SiGe tech is used for analog IC design including I/Q baseband, FSK modulation and synthesizer.  Fabrication process is slightly different between two processes. Secondly, generally speaking, better performance/quality need to get more cost. It is indispensable to use extra material  to meet the switching response time for this application.

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Brad Albing
Brad Albing
5/14/2013 3:15:14 PM
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Blogger
Re: Function Block -IC
DaeJ - are you suggesting a processhat will combine CMOS & BiCMOS with SiGe technology?

For the size of the IC, if it gets too large, it will be in danger of breaking if the PC board is flexed. Of course, you could use stronger packaging material, but that will increase the cost.

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Brad Albing
Brad Albing
5/14/2013 3:09:16 PM
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Blogger
Re: 3D-ICs and 3D Transistors
Any reference info that you can direct me to that gives more details of the 3D ICs and transistors?

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DaeJ
DaeJ
5/9/2013 9:55:31 PM
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Master
Function Block -IC
More analog circuit is required as more functional increased inside chip. IC is highly fabricated by CMOS and SiGe BiCMOS technology as one of methods. Plus, Chip is very visible under Micrograph.  Package size of IC could be increased if facing the limitation. I am not sure whether or there is a major limitation to integration.

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analoging
analoging
5/9/2013 9:17:38 PM
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Blogger
3D-ICs and 3D Transistors
The advanced high-performance branch of the semiconductor industry is moving towards 3D transistors rather than 2D, planar as is common today which will help extend scaling in a different way. One should not be overly concerned with Moore's Law limit as companies are finding creative ways to enhanced chip density per wafer with 3D NAND and 3D logic architectures. In addition, chip stacking is an emerging trend for advanced packaging utilizing through-silicon metal vias to link multiple chips in a single package. This technology applies to analog ICs as well.

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