EPCOS has set another milestone in miniaturization of passive electronic components for the CDMA 850 mobile radio standard with the PaiD (power amplifier with integrated duplexer) module, which measures only 8.0 x 5.0 x 1.5 mm.
Conventional solutions for CDMA 850 mobile handsets are based on discrete designs that require power amplifier modules (PAs), SAW duplexers, SAW filters, and coupling capacitors. EPCOS has set itself the goal of integrating PAs and duplexers in LTCC modules and thus reducing space requirements significantly. As well as saving board space, customers benefit from high cost efficiency combined with improved electrical properties.
Thanks to combination of InGaP HBT PAs featuring outstanding temperature stability with SAW duplexers and filters from EPCOS, this LTCC module has good electrical properties and makes significantly longer talk times possible.
Samples are available from November. From mid-2005, PaiD modules will be offered for the PCS band as well.
EPCOS , 86617 Munich, Germany.