The 3200E single-chip device integrates Inphi's patented analog signal processing EDC technology with XFI-compliant transmit and receive CDRs in a compact 7-mm x 7-mm QFN package. Replacing up to three separate chips, the 3200EC simplifies the design and reduces the bill of materials of an XFP transceiver module.
Used with Inphi's 1348TA Linear Trans-Impedance Amplifier (TIA), the 3200EC reduces development costs and accelerates delivery of standards-compliant 10GBASE-LRM XFP modules.
Availability: Immediately as engineering samples with mass production expected in the second quarter of 2008.
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Inphi Corp., www.inphi-corp.com