Santa Clara, Calif. — DesignCon 2008 kicked off this week in Santa Clara, Calif. with a host of electronics companies releasing new products and demos. You'll find that a lot of interconnect manufacturers made a big splash with high-speed, high-density products for next-generation equipment.
Here is a list of the latest releases ranging from bus transceivers to test instruments.
Gigabit backplane bus transceiver embeds oscilloscope-like function for signal-integrity assessment
Gore demos active copper interconnects at 10 Gbits/s per channel
Gennum, Meritec demo 10 Gbits/s data transmission over low-cost copper cable
Mezzanine connectors deliver high density, high speed
SFP+ interconnect family operates up to 10 Gbits/s
Power module connector delivers 18 amps per contact
Backplane connector delivers 10 to 12.5 Gbits/s data rate
Molex delivers high-speed, high-density backplane connector system
Amphenol adds stacking version to high-speed connector platform
Contact interface delivers high density, high speed
High-speed connector delivers 10 Gbits/s+ data rates
Analog IC incorporates adjustable resistor technology
Precision waveform analyzer touts lowest intrinsic jitter
Automated compliance test tool supports UWB, Serial ATA and PCIe Gen 1
Tektronix uses National Instruments’ tester in Serial ATA effort
12.5 Gbits/s test instrument delivers programmable 3-tap pre-emphasis
Tektronix launches automated compliance test suite for serial ATA
Agilent adds transceiver model library to ADS EDA software
High-performance scope breaks 1-Gpt memory barrier
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