DSP drives Broadcom’s 65-nm, 10 GbE SFP+ dual-PHY chips

Commack, NY &#151 Broadcom’s BCM8727 dual 10GbE SFI-to-XAUI PHY and BCM8750 dual 10 GbE SFI-to-XFI PHY are DSP-based, low-power, dual 10 Gigabit Ethernet SFP+ physical-layer (PHY) devices in 65-nm CMOS. The devices are designed to enable a low-cost fiber infrastructure upgrade path from 1 to 10 GbE.

Features include DSP-based electronic dispersion compensation (EDC) equalizer technology, multi-tap transmit pre-emphasis to compensate for FR-4 board material loss in line card applications, backward compatibility using existing 1GbE SFP modules.

Datasheets: BCM8727, BCM8750.

Availability: Currently sampling to customers. The BCM8727 is available in a 19- x 19-mm, BGA, RoHS-compliant package while the BCM8750 is available in a 12- x 12-mm, BGA, RoHS-compliant package.

Pricing : Available upon request.

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