Agilent Technologies announced the industry's smallest encoder-decoder (EnDec) chip for use in mobile phones and many other applications that require serial infrared (SIR) connectivity.
The EnDec features a 75% smaller form factor , enabling greater use of infrared (IR) transceivers for point-to-point wireless communications in mobile phones and other small portable devices. The HSDL-7002 SIR EnDec measures 0.8 mm high, with a footprint of 4.0 x 4.0 mm. It complies with the IrDA (Infrared Data Association) 115.2 kb/s SIR specifications and is supplied in a 16-pin, quad-flat-no lead (QFN) package.
The EnDec provides the same performance as the previous HSDL-7001 SIR EnDec, but features a significantly smaller footprint and 10 to 20% reduction in cost. The EnDec chip provides pulse shaping for the IR transceivers that offer wireless connectivity in applications such as mobile phones, pagers, notebook computers, PDAs, desktop PCs, printers, and handheld data collection terminals. It provides a direct interface between the transceiver and a standard 16550 UART (universal asynchronous receiver-transmitter) or microcontroller.
In transmit mode, the EnDec shortens the UART/RS-232 output signal to IrDA-compatible pulses of 1.6 microseconds or 3/16 of the bit duration required to drive the IR transmitter. In receive mode, the EnDec stretches IR pulses to bit widths appropriate to the current operating bit rate, which may range from 1.2 kb/s to 115.2 kb/s.
The Agilent HSDL-7002 is fully compliant with the IrDA Physical Layer 1.4 low power specification from 9.6 kb/s to 115.2 kb/s and the industry-standard 16550 UART specification. It can use an internal or external 3.6864 MHz clock signal, and operates from 2.7 to 5.5V.
Agilent Technologies Inc , 35578 Wetzlar, Germany.