Dallas, TX (February 12, 2004) – Enabling wireless and personal digital assistant (PDA) designers to conserve board space while gaining efficiency, Texas Instruments Incorporated (TI) announced the smallest and highest performance filter-free Class-D mono audio power amplifier in the market. This 2.5-W device is available in TI's state-of-the-art Wafer Chip Scale Package (WCSP), which measures only 1.45mm by 1.45 mm and comes in lead and lead-free ball options. The TPA2010D1 is ideal for end equipments where high efficiency and board space are critical, such as cell phones, smart phones and PDAs.
“The TPA2010D1 squeezes all the benefits of a high-efficiency, filter-free Class-D audio power amplifier into a minuscule package solution,” said Gregg Lowe, senior vice president of TI's High Performance Analog division. “Providing a new WCSP package option for TI's Class-D audio power amplifiers allows us to further strengthen our relationship with key wireless and PDA manufacturers.”
The TPA2010D1 is designed to use a very small amount of board real-estate and provide a large amount of output power (2.5-W) while maximizing the battery life in portable equipment using audio such as cell phones, smart phones and PDAs. The 88 percent efficiency reached with a typical 8-ohm speaker means that only a very small amount of power is wasted as heat and the low operation and shutdown current of 2.8-mA and 0.5-uA, respectively, saves valuable battery charge. Furthermore, the fully-differential architecture virtually removes effects like “RF-rectification:” a common issue in TDMA and GSM mobile phones. The device needs only three external components for correct operation and was designed for maximum system flexibility.
The TPA2010D1 comes in a WCSP with lead and lead-free ball options and is available now from TI and its authorized distributors. Suggested resale pricing in 1000-piece quantities is $0.55.
The TPA2010D1 can interface to a number of TI products such as CODECs and wireless analog baseband chips. TI is the leading manufacturer of wireless semiconductors, delivering the heart of today's wireless technology and building solutions for tomorrow. TI provides a breadth of silicon and software and 15 years of wireless systems expertise that spans handsets and base stations for all communications standards, wireless LAN, Bluetooth and Ultra Wideband. TI offers custom to turn-key solutions, including complete chipsets and reference designs, OMAP application processors, as well as core digital signal processor and analog technologies built on advanced semiconductor processes.
See www.ti.com/sc04046 for more information.