Advertisement

Article

Foundry expands multi-project wafer prototyping service

austriamicrosystems' is expanding its ASIC prototyping service in 2009, greatly increasing the availability of shuttle runs on its 0.18m cmos and high-voltage cmos processes.

The company's Multi-Project Wafer (MPW) service, which combines several designs from different customers onto one wafer to reduce prototyping costs, will offer three runs for its 0.18m H18 high-voltage cmos technology, and four runs for the CMOS7RF base technology. The latter suits smart power management ics in handsets, PDAs, portable media players and other mobile devices.

austriamicrosystems will provide sixteen runs on the CMOS-compatible 0.35m Silicon-Germanium BiCMOS process it took over from TSMC ?when?. This enables mixed signal/RF circuit designs with an operating frequency up to 10GHz. Meanwhile, there's a 0.35m 20V CMOS option, suiting power management products and display drivers; a 50V CMOS process, optimised for automotive and industrial applications; and a 120V module for sensor and sensor interface chips.

Foundry customers for austriamicrosystems' MPW service deliver their completed GDSII-data on specific dates and receive untested packaged samples or dies within a typical lead-time of eight weeks for CMOS and ten weeks for 0.35m High-Voltage CMOS and SiGe-BiCMOS.

In all, austriamicrosystems will offer more than 150 MPW start dates in 2009 ” made feasible through its collaboration with organisations such as CMP-TIMA, Europractice, Fraunhofer IIS and Mosis. The complete schedule for 2009 and the various start dates for each process can be found here

Design kit gives access to high voltage process technology

0 comments on “Foundry expands multi-project wafer prototyping service

Leave a Reply

This site uses Akismet to reduce spam. Learn how your comment data is processed.