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GaAs chip integrates Wi-Fi, Bluetooth RF front ends

Warren, N.J.—ANADIGICS Inc. has started to sample a family of three front-end ICs (FEICs) in low profile standard packages targeting next-generation, WiFi-enabled smart phones and consumer electronics products.

The AWL9230, 9231 and 9232 FEICs offer a high level of GaAs on chip integration by incorporating a power amplifier (PA), a low-noise amplifier (LNA), a Bluetooth path, and an RF antenna switch all in a single low-profile package measuring 3 mm x 3 mm x 0.55 mm. The small physical size is made possible by the exclusive ANADIGICS InGaP-Plus process technology, which allows all three functions to fit on a single GaAs die.
The AWL9230 FEIC family is compatible with 802.11 b/g and 802.11n MIMO WiFi standards. Applications include mobile products such as smart phones, cameras, game controllers, ultra-mobile notebook computers, and USB adapters.

The FEICs require one capacitor and one inductor outside the standard plastic package and they are designed to interface directly with a WiFi/Bluetooth chipset. The AWL9230 FEIC achieves 3.5% EVM and draws 140 mA of current at an output power of +19 dBm. Designed for lower-voltage applications, the AWL9231 achieves 3.5% EVM and draws 135 mA of current at an output power of +18 dBm. For higher-power applications, the AWL9232 achieves 3.5% EVM and draws 175 mA of current at an output power of +21 dBm.

Datasheet: click here.

ANADIGICS Inc., 1-908-668-5000, www.anadigics.com

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