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GaN: The high frequency substrate suitable for 5G applications, Part 10

GaN is a promising substrate for future development of sets of possible applications for the electronics technology. The semiconductor market is focusing on the possibility of combining GaN with other types of substrates to obtain an enhancement of performance in many industry segments such as shown in the following Figure 1:

“… the GaN’s presence and development scheme in different markets including wireless infrastructure, defense and aerospace, satellite communication, wired broadband and other ISM band applications. The “More than Moore” market research and strategy consulting company, Yole proposes a complete analysis covering different emerging GaN players and more than 600 GaN devices developed and implemented in such applications as radar, base transceiver station, CATV , VSAT and jammers. This report also includes a detailed analysis of the different scenarios related to GaN-on-SiC and GaN-on-Si developments beyond 2020. Sales will likely not soar as high over the next two years, but growth will continue, mainly driven by increased adoption of GaN technology in the wireless infrastructure and defense markets. A significant boost will occur around 2019 – 2020, led by the implementation of 5G networks. “Market size will be multiplied by 2.5 by the end of 2022, posting a CAGR of 14% from 2016 – 2022”, explains Dr Hong Lin, Technology & Market Analyst at Yole.” (Source: Yole Développement)

Figure 1

The market strategies related to the utilization of GaN material in electronics (Source: Yole Développement)

 

The market strategies related to the utilization of GaN material in electronics (Source: Yole Développement)

 

The ICs realized with GaN have shown very good performance when used as a part of the setup in 5G technology, which is quickly adopting GaN because of the excellent properties of this material in a very wide range of frequencies (see Figure 2):

“Engineering substrate is a combination of multiple material stacks. In principle, anything can be stacked on anything, even on nothing. There are three main expertises that are required to build those engineered substrates: Smart Cut™, Smart Stacking™, Epitaxy ….. Fourth expertise is in the DNA of engineered substrate engineers: material sciences. Silicon is the most well-known material. Compound materials such as Gallium Arsenide (GaAs), Gallium Nitride (GaN), Indium Phosphide (InP), etc… are particularly interesting for RF and High Power applications as well as photonics and lighting. For companies willing to play in those applications, compound semiconductors expertise is also required.” (Source: GTI 5G Device RF Component Research Report)

Figure 2

'Product and Technology per Front-End modules range, Skyworks' (Source: GTI 5G Device RF Component Research Report)

 

”Product and Technology per Front-End modules range, Skyworks” (Source: GTI 5G Device RF Component Research Report)

 

Have you had the chance to verify the performance enhancements guaranteed by the utilization of GaN substrates for Front End modules of 5G communication technology? Do you think this type of substrate will be largely adopted in the future development of the electronics technology? Please share your experiences with our audience

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