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Hot products debut at Mobile World Congress

New York, N.Y.—The 2008 GSMA Mobile World Congress kicked off in Barcelona, Spain this week featuring the latest in technology, services and developments aimed at advancing mobile broadband worldwide.

eeProductCenter is providing its readers with a compilation of products from Mobile World Congress that all have one thing in common: to drive the success of the mobile industry over the next year. Check here for daily updates on the hot products being introduced at the show.

RF SoC supports global TV standards for cell phones

Front-end module targets 3.9G wireless applications

Quad-core multi-threaded processors support Serial RapidIO, IEEE1588

Mobile TV ICs deliver high integration, energy efficiency

IXIA to demo mobile network testing with real-world triple-play traffic

AMD unveils multimedia products for media-rich mobile devices

Real-time signaling analyzer incorporates LTE, SAE technology

Programmable transceiver spans 700MHz to 3.8GHz

DVB-H/T receiver housed in 5-mm x 5-mm CSP package

TriQuint shrinks quad-band edge PA modules by 50%

MIPI D-PHY test solution delivers digital serial analysis for mobile devices

Cavium Networks expands multi-core MIPS64 processor family

Sequoia announces transceiver support for multiple wireless specs

RF Transceiver targets 2G and 3G modes with a single chip

Antenna chip sharpens mobile digital TV reception

Ultra-low-power audio codec integrates Class G headphone amp

Applications processor enhances content viewing on mobile devices

RF power amplifier claims exceptional linearity, efficiency

Agilent adds WiMAX manufacturing test support for Sequans Wave 2 chipset

Li-ion battery charger ICs optimize battery life, performance

CMOS RF switches offer GaAs performance

Xilinx, Freescale demo DPD design for efficient Pas

ARM expands development tools for pre-silicon mobile design

OmniVision single-chip 3-megapixel CameraChip hits Barcelona

Transmit processor aims to improve efficiency

Audience voice processor mimics human hearing to improve mobile calls

Samsung touts chip advances at Mobile Congress

NVidia rolls first cellular CPU

NXP demonstrates dual-mode EDGE-WiMAX reference design

CEVA adds RealVideo, VC-1 to its media platform

Mobile TV heats up with Broadcom’s 65-nm SoC

TI delivers single chip baseband solution

Kit does digital filtering for wideband signal repeaters

TI rolls infrastructure platform for HSPA+

Kodak sets new pixel-size benchmark for 5-MP CMOS image sensors

Audio and power management IC delivers longer battery life, lower cost

TriQuint launches two new RF modules

IFT software delivers real-world stress test for cellular phones

Low-power silicon tuner supports all global mobile broadcast standards

Agilent to introduce 3GPP LTE test solutions

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