On Tuesday, June 25 at 2:00 p.m. ET, we will be having another chat. The topic is “Analog integration is increasing: How can we best get the heat out?” This discussion will be based on a recent blog by Steve Taranovich, (Synthetic) Diamonds Are a Designer’s Best Friend.
With more and more functionality being packed onto ICs, power dissipation increases, and with that, the die temperature rises. New methods are being developed to pull the heat out. Among the most promising is the use of a synthetic diamond material.
We'll discuss the physics of heat conduction just a bit and then look at the details of the new technology.
We will be inviting industry experts from Element Six (synthetic diamond), Thermalloy (heat sinks), JEDEC (standards), Vicor (a unique IC thermal design), and a thermoelectric cooler supplier. As we get confirmations of our invited guests we will post updates.
The chat (similar to using an instant messaging system but in this case browser-based) will start at 2:00 p.m. ET, on Tuesday, June 25.
All you have to do is click here at the appropriate time to join the discussion. If you aren't already registered on Planet Analog, register in advance to speed things up. Registration just takes a few minutes. We look forward to seeing you on Tuesday. Bring your questions and comments.