Tomorrow, June 25, at 2:00 p.m. EDT, we will be having another chat. The topic is “Analog integration is increasing: How can we best get the heat out?” This discussion will be based on a recent blog by Steve Taranovich: (Synthetic) Diamonds Are a Designer’s Best Friend.
With more and more functionality being packed onto ICs, power dissipation increases, and with that, the die temperature rises. New methods are being developed to pull the heat out. Among the most promising is the use of a synthetic diamond material.
We'll discuss the physics of heat conduction just a bit, and then look at the details of the new technology.
We will have industry experts from Element Six (Synthetic diamond), Microchip, EPC, and a few other companies on hand.
The chat (similar to using an instant messaging system, but in this case, browser based) will start at 2:00 p.m. EDT, Tuesday, June 25th.
All you have to do is to click here at the appropriate time to join the discussion. Note: If you aren’t already registered on Planet Analog, register in advance to speed things up. Registration just takes a few minutes. We look forward to seeing you tomorrow. Bring your questions and comments.