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Leadless MOSFET achieves 40 percent lower thermal resistance

Hauppauge, N.Y. — The ZXMN2F34MA leadless MOSFET from Zetex Semiconductors provides a 50 percent smaller footprint than SOT23 packaged devices, and 40 percent lower thermal resistance compared to comparable parts, according to the company.

Housed in a 2 x 2-mm DFN322 package with an off-board height of 0.85 mm, the ZXMN2F34MA is suitable for switching and power management applications such as external switches in buck/boost PoL converters, where PCB footprint, thermal performance and low threshold voltage are key design concerns.

Rated at 20 V, the MOSFET's low thermal resistance enables cooler running and improved power density. At typical gate source voltages of 4.5 V and 2.5 V, the respective RDS(ON) values are 60 mΩ and 120 mΩ. The low reverse recovery charge reduces switching loss and EMI problems, which is critical for low-voltage, portable electronics requiring longer recharge intervals, said Zetex.

Pricing: $0.10 each in quantities of 10,000.
Availability: Delivery is four to six weeks in production volumes.
Product information: ZXMN2F34MA MOSFET

Zetex Semiconductors , www.zetex.com

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