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goafrit2
goafrit2
6/25/2013 1:58:27 PM
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Master
Re: Be there
It is time, let us get started

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analoging
analoging
6/13/2013 8:45:27 PM
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Re: Be there
Hoping to finally join in one of these sessions. Great chance to communicate on a whole new level. Other related blog sites are utilizing this forum more regularly. Good luck to all involved. 

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Brad Albing
Brad Albing
6/11/2013 1:46:55 PM
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Re: Be there
Thanks Derek - looking forward to a good discussion.

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DEREK.KOONCE
DEREK.KOONCE
6/11/2013 1:45:11 PM
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Master
Be there
Look forward to this one.

As for heat dissipation, there is copper usage to help pull heat out to the leadframe of the package - internall solution.

External solution -- I was involved with one custom IC that dissipated 12W in a 0.25" square (or there abouts). With over 10 of these on a board, there was quite a bit of heat that needed to be dissipated. Solution ended up being a heatsink attached on top of all the BGA die and using a fluid to pull heat out.

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