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Brad Albing
Brad Albing
6/20/2013 1:14:40 PM
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Re: figure detail
There - that looks better.

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Brad Albing
Brad Albing
6/19/2013 10:03:41 PM
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Re: figure detail
We will get the image tweaked and sharpened. Stand by.

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Damian Anzaldo
Damian Anzaldo
6/19/2013 1:19:14 PM
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Re: figure detail
 @analoging

Thanks for the reply...I'll see if a better quality image can be uploaded.

A little background related to your comments:

I am referring to direct RF synthesis using an RF-DAC with devices like MAX5879 or MAX5881 which are not intended for use in mobile devices. The applications for RF-DAC are broadband communications infrastructure equipment such as multi-carrier/multi-standard/multi-band cellular base stations, broadband cable TV distribution (CMTS and EQAM), microwave point-to-point (P2P) radio links and radar systems. These applications require excellent broadband performance for example: high RF carrier frequencies up to 2.6GHz (LTE Bands 7, 15, 16) and wide bandwidths up to 500MHz for multi-band base stations or up to 1GHz in cable TV networks; high dynamic range to support high order modulation such as 1024QAM used in microwave P2P or 64QAM in LTE downlink or 256QAM in cable TV downstream spectrum; and excellent dynamic performance like 74dB IMD for 4-carrier GSM or 67dBc ACLR for 4-carrier WCDMA.

Mobile devices cannot meet, and do not need to meet, this level of dynamic performance.

Yes, SOC and SIP are often used in mobile devices; however, for wireless infrastructure the digital processing is much more powerful so it is not practical to integrate all the DSP with analog; however, devices like MAX5898 integrate some of the digital processing functions like digital quadrature modulator and interpolating filters along with a dual 16-bit, 500Msps DAC core.

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analoging
analoging
6/18/2013 8:38:10 PM
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figure detail
Interesting post. However, are we actually supposed to discern the detail of the figure or it is just for show? There is an increased initiative of combining digital and analog chips in a single package for smaller and thinner mobile devices called system-on-chip and/or system-in-package technology. I could share but looks like the window is closing for me on this site.

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