Nanium ramps wafer-level packaging

LONDON – Nanium SA (Porto, Portugal), formerly known as Qimonda Portugal and one of few chip packaging and test companies left in Europe,  has announced it has shipped its 200 millionth embedded wafer-level BGA (eWLB) component for wireless communications and other applications.

The main reason to use eWLB technology is that it allows greater fan-out and pin-counts than conventional wafer-level packaging and more space for interconnect routing and thinner packages.

The 300-mm eWLB uses a combination of front-end and back-end semiconductor manufacturing techniques, and Nanium said it has adapted the process for consumer MEMS, stacked-die DRAM multichip packages (MCP) and mixed-signal RF ASIC applications.

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“This milestone, which we have reached in less than two years, demonstrates that eWLB technology is a robust low-cost solution delivering both high reliability and high yields for manufacturing advanced electronic products with high I/O density in a small form-factor,” said Armando Tavares, Nanium president, in a statement.

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