Next-generation RF chip added to ZigBee PiP line

Orlando, Fla.—Freescale Semiconductor is now sampling the next-generation MC13224 device in its single-chip IEEE 802.15.4/ZigBee Platform-in-Package (PiP) family.

The latest addition to the MC1322x family is designed for a range of wireless applications, including energy management, commercial building automation, industrial control and monitoring and home entertainment control. The family supports existing protocols, such as SMAC, IEEE 802.15.4 MAC, ZigBee stack and Synkro network protocol stack, with the ability to support the WirelessHART specification, ISA100 and 6LoWPAN.

The MC13224 device integrates the essential components of an IEEE 802.15.4 based application within a single package, requiring designers to add only an antenna and crystal. The MC13224 contains a 32-bit ARM7 microcontroller (MCU), a fully compliant IEEE 802.15.4 transceiver, flash, RAM and ROM, high-performance peripherals, balun and RF matching components. This is all integrated into a small-footprint land-grid array (LGA) package that virtually eliminates the need for external RF matching components.

The MC13224's operating currents and RF performance specs include typical transmit currents of 28 mA and receive currents of 21 mA that can even be lower with MCU bus stealing enabled. It also delivers receive sensitivity of up to -100 dBm and maximum output power of + 5 dBm. Onboard power supply regulation is provided for source voltages from 1.8 Vdc to 3.6 Vdc, and can operate over an extended temperature range up to +105°C.

Pricing: In 10K resale quantities is $4.99.
Availability: MC1322x development kits are orderable now. Production quantities are expected to be available in September.
For more information: Click here.

Freescale Semiconductor,

0 comments on “Next-generation RF chip added to ZigBee PiP line

Leave a Reply

This site uses Akismet to reduce spam. Learn how your comment data is processed.