Advertisement

Blog

Sensing Your Brain With IC Microprobes

Scientists and neural researchers have been probing the brain (human and other animals) for quite a few years in an attempt to learn how it works and fix what goes wrong. Based on recent integrated circuit work, researchers should have a better, higher resolution way to gather information soon.

A recent IEEE/ISSCC paper[1] shows the way to integrate the microprobes that contact brain cells with the IC that processes the information. The microprobes are fabricated with multiple layers with the outermost being platinum over titanium. Figure 1 shows what the probes look like. Length is about 150μm. (This image and all others are taken from the paper.)

Figure 1

Pt/Ti microprobes

Pt/Ti microprobes

The probes are made by etching away the unwanted silicon and vapor depositing the metal — standard techniques for IC fabrication.

The beauty of the design is that the processing circuitry is right next to the probes (on the other side of the chip, actually). That circuitry consists of the expected passive components, through-silicon-vias (TSVs), and the active circuitry. The vias connect the probes to the active circuitry. Figure 2 shows a bit of detail.

Figure 2

Details of the probes, TSVs, and active circuitry

Details of the probes, TSVs, and active circuitry

This eliminates the usual long wires carrying weak signals from probes to circuit boards where the amplifiers would normally process those signals.

The authors provide some additional details on how elements are interconnected and some dimensions:

MEMS neural microprobe array and low-power CMOS readout circuit are fabricated on two sides of the same silicon substrate, and TSVs are used to form a low impedance interconnection between the microprobe and CMOS circuitry, thus providing the shortest signal transmission distance from sensors to circuits. The low parasitic impedance of TSV minimizes transmission loss and noise. The overall chip is 5x5mm2 , 350μm in thickness including 150μm probe height and 200μm TSV height, respectively. A total of 480 microprobes is divided into 4×4 sensing areas, forming 16 channels.

Leakage current on the chip from any one TSV to another nearby TSV (200 μm apart) is on the order of a few pA. The TSVs show good conduction (5.5mΩ) and extremely low parasitic capacitance (around 34fF), measured up to 10GHz.

All this combines to produce a circuit without the usual IR-drop and noise pickup problems associated with the usual long cabling. The active circuitry on the chip is fairly recognizable analog front end (AFE) that most analog engineers will know as that used with EEG applications:

Figure 3

The AFE

The AFE

The IC has additional biasing and current mirror circuitry onboard.

Figure 4

IC layout

IC layout

This IC exhibits very good CMRR and has low noise. These are probably the two most important criteria for these applications.

References 1. ” Through-Silicon-Via-Based Double-Side Integrated Microsystem for Neural Sensing Applications” by Chih-Wei Chang, Po-Tsang Huang, Lei-Chun Chou, Shang-Lin Wu, Shih-Wei Lee, Ching-Te Chuang, Kuan-Neng Chen, Jin-Chern Chiou, Wei Hwang, Yen-Chi Lee, Chung-Hsi Wu, Kuo-Hua Chen, Chi-Tsung Chiu, and Ho-Ming Tong; published by the IEEE as part of the International Solid-State Circuits Conference. Registration required for viewing or downloading documents.

Related posts:

6 comments on “Sensing Your Brain With IC Microprobes

  1. eafpres
    July 16, 2013

    @Brad–this is very cool stuff.  I looked up the paper and could not see where they discussed exactly how this is interfaced to the brain.  Would you understanding be that they cut holes in the skull and stick these through?

  2. Brad_Albing
    July 16, 2013

    @eafpres – Pretty sure that's exactly how it's done. But the nice thing here is that they can contact lots of of brain tissue (or sites) with one of these devices. Whereas conventional probes would be hand placed and would therefore be far less densely placed.

    So that's great for research or for neuro-therapy.

  3. BillWM
    July 17, 2013

    At 5mm x 5mm still it is very small, but high resolution  — one could easily pull video with just a 1cm hole in the back of the skull — Mems power sources and energy storage, allow for indefinite power.  Hope for the visually impared. 

  4. Brad_Albing
    July 18, 2013

    @WM – hadn't thought about using them in the reverse direction (to push signals into the brain). Seems like that would be another research area to explore.

  5. SunitaT
    July 29, 2013

    The recently developed systems at BMES will allow bi-directional communication with tissue and by doing so allow implantable/portable microelectronic devices to treat currently incurable human diseases such as blindness, paralysis, and memory loss. These schemes use cortical signals as inputs to a brain–machine interface. The fundamentals of these systems are (1) Recording Units (microelectrode arrays) involved of micro-wires, silicon micro machined microprobes, and tissue reactions, (2) Decoding Units (extraction algorithms), and (3) Actuators (prosthetic effectors) comprised of computers, robotic arms or stimulators.

  6. Brad_Albing
    July 30, 2013

    @Sunita – There is probably enough info there that I could write 5 more blogs on related topics. Or maybe one of our other bloggers will do that.

Leave a Reply

This site uses Akismet to reduce spam. Learn how your comment data is processed.