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Soitec Announces Volume Production of new Generation of High-Resistivity SOI Substrates for Cellular Phone and Wi-Fi Markets

BERNIN, France , February 16, 2010 /PRNewswire-FirstCall/ — The Soitec
Group (Euronext Paris), the world's leading supplier of engineered substrates
for the microelectronics industry, announced today volume production of its
new generation of state-of-the-art high-resistivity (HR) silicon-on-insulator
(SOI) substrates to serve the growing cellular phone and Wi-Fi markets.
Soitec recently completed qualification at major customers for volume
production in response to their rapidly growing demand. Soitec fined-tuned
its HR-SOI process to stabilize the base wafer resistivity in order to meet
all cellular electrical specifications.

The shift to multi-band, multi-mode radio functionality in today's
handsets and the growth of Wi-Fi based-applications is driving a move to
SOI-enabled solutions, which can enhance integration and programmability
while reducing cost-of-ownership (COO) in RF Front End Modules more
effectively than competing technologies. Soitec's Smart Cut technology is
used to integrate a high resistivity base wafer enabling low signal
absorption below the oxide. This high-resistivity option for SOI wafers
enables chip designers to reach unprecedented levels of RF and mixed signal
integration, which will free up valuable area for the RF functions by a
factor of ten on the board.

“Our HR-SOI capacity is in place to serve the growing cellular market
demand,” says Paul Boudre, Chief Operating Officer, Soitec. “This new
substrate generation enables chip designers to meet their demanding wireless
performance requirements – low RF substrate loss, high isolation, high
linearity – on very cost-effective silicon.”

High-resistivity handle layers can also be combined with advanced SOI
technologies that leverage a very thin top layer of silicon. Such wafers are
excellent candidates for combining wireless functionality with lower power
and higher speed logic on a single chip using a standard SOI CMOS process.

Manufactured in 200mm, Soitec's HR SOI substrates offer >1kOhm.cm
resistivity, available in any custom silicon and box thickness. The company
also offers HR SOI substrates in 300mm for the system on chip (SoC) market
working at the 90nm node and below.

About the Soitec Group:

The Soitec Group is the world's leading innovator and provider of the
engineered substrate solutions that serve as the foundation for today's most
advanced microelectronic products. The group leverages its proprietary Smart
Cut(TM) technology to engineer new substrate solutions, such as
silicon-on-insulator (SOI) wafers, which became the first high-volume
application for this proprietary technology. Since then, SOI has emerged as
the material platform of the future, enabling the production of higher
performing, faster chips that consume less power.

Today, Soitec produces more than 80 percent of the world's SOI wafers.
Headquartered in Bernin, France , with two high-volume fabs on-site, Soitec
has offices throughout the United States , Japan and Taiwan , and a new
production site in Singapore .

Three other divisions, Picogiga International, Tracit Technologies and
Concentrix Solar, complete the Soitec Group. Picogiga delivers advanced
substrates solutions, including III-V epiwafers and gallium nitride (GaN)
wafers, to the compound material world for the manufacture of high-frequency
electronics and other optoelectronic devices. Tracit, on the other hand,
provides thin-film layer transfer technologies used to manufacture advanced
substrates for power ICs and Microsystems, as well as generic circuit
transfer technology, Smart Stacking for applications such as image sensors
and 3D-integration. In December 2009 , Soitec acquired 80% of Concentrix
Solar, the leading provider of concentrated photovoltaic (CPV) solar systems
for the industrial production of energy. With this acquisition, Soitec is
entering the fast-growing solar industry; capturing value through the system
level. Shares of the Soitec Group are listed on Euronext Paris. For more
information, visit http://www.soitec.com.

Soitec, Smart Cut, Smart Stacking and UNIBOND are trademarks of S.O.I.TEC
Silicon On Insulator Technologies.

    International Media Contact
    Camille Darnaud-Dufour
    +33(0)6-79-49-51-43
    camille.darnaud-dufour@soitec.fr

    Investor Relations Contact
    Olivier Brice
    +33(0)4-76-92-93-80
    olivier.brice@soitec.fr

    French Media Contact
    Muriel Martin, H&B
    +33(0)1-58-18-32-44
    m.martin@hbcommunication.fr


SOURCE Soitec

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