PARIS — Tanner EDA, a division of Tanner Research Inc. (Monrovia, Calif.), announced it has combined its specialized IC design software combined with integrated passives and chip-stacking technologies from Sound Design Technologies Ltd. (Ontario, Canada).

Tanner EDA and Sound Design Technologies (SDT) said they have developed process design kits for analog/mixed-signal (A/MS) designers using Tanner EDA's HiPer Silicon software.

Through this partnership, Tanner EDA's customers gain access to SDT's SiPArray integrated passives technology and SDT's customers have access to Tanner EDA's A/MS tools for a complete IC design solution.

“Our collaboration with Tanner EDA provides our mutual customers with an advanced design platform and powerful design capabilities to integrate passive components into stacked die assemblies to reduce board space,” commented Ian Roane, president and CEO of Sound Design Technologies. “This will enable them to capitalize on advanced 3D packaging capabilities for breakthroughs in miniaturization and high performance solutions.”