BARCELONA, Spain , Feb. 15 /PRNewswire-FirstCall/ — Forging new pathways to the mobile future, Texas Instruments Incorporated (TI) (NYSE: TXN) today highlighted how its OMAP™ 4 platform spurs some of the industry's most sophisticated user experiences with capabilities that transform how consumers connect to the world and with their mobile devices. Delivering the performance and flexibility of a computing platform and meeting the frugal power requirements of a mobile solution, the OMAP 4 platform, sampling today, is being showcased this week in TI's Mobile World Congress 2010 booth (8A84, Hall 8). For more information, visit: www.ti.com/omap4-pr.
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“At TI, we strive to set the standard for innovation,” said Remi El-Ouazzane, vice president and general manager of TI's OMAP Platform Business Unit. “We are thrilled to see our partners accelerate the OMAP 4 platform's power to make the desktop experience on Smartphones a reality. We are confident that the next generation of OMAP 4 platform-based devices will truly 'wow' consumers.”
O MAP 4 platform provides a glimpse of the mobile future
Together with key partners, TI leads the industry enabling some of the most advanced features available in the market, such as one-of-a-kind 3D user interfaces (UIs), contextual browsing and multiple display support. Examples to see at TI's Mobile World Congress booth (8A84, Hall 8) include:
TI partner What show attendees will see Why it's exciting ------------------------------------------------------------------------- THE ASTONISHING TI's OMAP 4 platform runs a Shows how multi- TRIBE (TAT) highly advanced 3D UI, display support will with touch input spanning alter devices' usage multiple displays, models enabling multiple exciting applications. One of the demonstrated use cases features the ability to select a video clip from multiple textured streams and send the clip via HDMI to a 1080p HD monitor. MOVIAL New ways to surf the web on Industry's first Flash a mobile device, including 10.1 experience on an access to Adobe Flash 10.1 ARM Cortex-A9 SMP content, with a contextual platform, highlighting multi-screen version of how dual displays Movial IXS Browser running enhance mobile on TI's OMAP 4 platform, browsing experiences leveraging the ARM(R) and bring social Cortex(TM)-A9 SMP media-like architecture environments to consumers' pockets WIPRO TI's DLP(R) Pico(TM) technology, 3D gaming, fast accelerated graphics browsing and leveraging TI's 1GHz OMAP projecting 4 SMP processors, running applications on Android operating system larger screens using and applications DLP pico technology TELECA TI's OMAP 4 platform drives World's first dual displays running on demonstration of the Android platform Android running on multiple screens, opening the door for innovative applications that will continue to drive proliferation of Android in the marketplace. -------------------------------------------------------------------------
Helping customers and developers conceptualize and realize mobile success
As part of its vision for the future, TI also today unveiled its Blaze™ mobile development platform (MDP), the first in a family of OMAP 4 platform-based development tools. The Blaze MDP pairs the OMAP 4 platform with key peripheral support to provide mobile innovators with a complete system solution that eases the development process and transforms designs into real-life applications.
This eye-catching form factor is one of the industry's most advanced and comprehensive mobile development platforms available in the market today. The platform extends a rich legacy of open OMAP development platforms that support a variety of leading mobile operating systems and a vibrant open source community.The Blaze MDP is designed to give developers access to an optimal mix of mobile system components so they can innovate and create whenever an idea strikes. Out-of-the-box features include:
- Dual 3.7″ WVGA capacitive touch displays
- HDMI output for third screen display support
- DLP® Pico™ projector
- Three multi-megapixel cameras – one primary and two secondary
- Full sensor suite including accelerometer, compass, ambient light, proximity, barometric and temperature sensors
- Broad audio support including multiple digital microphones, stereo speakers and audio outputs
- WiLink™ 7.0 (WL1281), a single chip with Wi-Fi®, GPS, Bluetooth® and FM functionalities
TI's OMAP 4 platform is sampling today and is expected to be in production in the second half of 2010. This solution is intended for high-volume wireless OEMs and ODMs and is not available through distributors.
The Blaze development platform is available to select customers today. General availability is expected by mid-2010. For more information, please visit www.ti.com/orderblaze.
About Texas Instruments
Texas Instruments (NYSE: TXN) helps customers solve problems and develop new electronics that make the world smarter, healthier, safer, greener and more fun. A global semiconductor company, TI innovates through manufacturing, design and sales operations in more than 30 countries. For more information, go to www.ti.com.
OMAP, WiLink, Blaze and Pico are trademarks of Texas Instruments Inc. DLP is a registered trademark of Texas Instruments Inc. All other registered trademarks and trademarks belong to their respective owners.
SOURCE Texas Instruments